High Thermal Conductivity Silicon Nitride
Ideal as Insulating Substrate for High-Power Electronic Devices
High thermal conductivity silicon nitride is nearly as light as silicon carbide but is significantly stronger, with high fracture toughness that makes it resistant to impact and shocks. It can be polished to a surface roughness of Ra=0.02µm and is exceptionally wear resistant.
The substrate size offered by Goodfellow is 100mm x 100mm with a thickness of 0.32mm. Different sizes and thicknesses may be available upon request. In addition to high thermal conductivity silicon nitride in sheet form, Goodfellow can supply standard silicon nitride as powder, rods, sheets, spheres, targets and tubes.
CONTACT
Stephen Aldersley
Goodfellow Cambridge Ltd
info@goodfellow.com
www.goodfellow.com
+44 1480 424800
Sunday 20 March 2016 / file under Electronics | Engineering